All Things Ansys 062: Optimizing Materials Selection for Additive Manufacturing with Ansys Granta

 

Published on: May 4th, 2020
With: Eric Miller, Pam Waterman & Robert McCathren
Description:  

In this episode your host and Co-Founder of PADT, Eric Miller is joined by PADT’s Pam Waterman and Robert McCathren for a discussion on how Ansys Granta can be used to help optimize hardware selection for additive manufacturing. The Senvol Database details 1,000 AM machines and more than 850 compatible materials. Using this tool within Granta Selector, you can search and compare materials based on properties, type, or compatible machines.

If you would like to learn more about the Ansys tool and it’s applications for additive, check out our webinar on the topic here: https://bit.ly/2SAZN8G

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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Optimizing Materials Selection for Additive with ANSYS Granta – Webinar

There are hundreds of industrial AM machines and materials. New products come to market weekly, and picking the best option for a manufacturing or research project is a tough call. A wrong direction can be costly. This is where Ansys Granta and the Senvol Database come in handy. 

The Senvol Database details 1,000 AM machines and more than 850 compatible materials. Using this tool within Granta Selector, you can search and compare materials based on properties, type, or compatible machines. Identify and compare machines based on supported processes, manufacturer, required part size, cost, or compatible materials (and their properties). Quickly focus on the most likely routes to achieve project goals, save time and get new ideas as you research AM options.

Join PADT’s Application Engineer Robert McCathren for an overview of Ganta Material Selector, along with its importance and applications for those working with or interested in additive manufacturing.

Register Here

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All Things Ansys 061: Bring Your Simulation Home with Ansys Cloud Solutions

 

Published on: April 20th, 2020
With: Eric Miller & Sina Ghods
Description:  

In this episode your host and Co-Founder of PADT, Eric Miller is joined by PADT’s Senior Simulation Support & Application Engineer Sina Ghods for a look at what is new with Ansys Cloud and how the tool provides access to higher fidelity models, faster turnaround, and multiple supported solvers, anywhere and anytime.

If you would like to learn more about the Ansys tool offering access to simulation on the go, check out our webinar on the topic here: https://bit.ly/3al5PjH

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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Making Sense of DC IR Results in Ansys SIwave

In this article I will cover a Voltage Drop (DC IR) simulation in SIwave, applying realistic power delivery setup on a simple 4-layer PCB design. The main goal for this project is to understand what data we receive by running DC IR simulation, how to verify it, and what is the best way of using it.

And before I open my tools and start diving deep into this topic, I would like to thank Zachary Donathan for asking the right questions and having deep meaningful technical discussions with me on some related subjects. He may not have known, but he was helping me to shape up this article in my head!

Design Setup

There are many different power nets present on the board under test, however I will be focusing on two widely spread nets +1.2V and +3.3V. Both nets are being supplied through Voltage Regulator Module (VRM), which will be assigned as a Voltage Source in our analysis. After careful assessment of the board design, I identified the most critical components for the power delivery to include in the analysis as Current Sources (also known as ‘sinks’). Two DRAM small outline integrated circuit (SOIC) components D1 and D2 are supplied with +1.2V. While power net +3.3V provides voltage to two quad flat package (QFP) microcontrollers U20 and U21, mini PCIE connector, and hex Schmitt-Trigger inverter U1.

Fig. 1. Power Delivery Network setting for a DC IR analysis

Figure 1 shows the ‘floor plan’ of the DC IR analysis setup with 1.2V voltage path highlighted in yellow and 3.3V path highlighted in light blue.

Before we assign any Voltage and Current sources, we need to define pin groups for all nets +1.2V, +3.3V and GND for all PDN component mentioned above. Having pin groups will significantly simplify the reviewing process of the results. Also, it is generally a good practice to start the DC IR analysis from the ‘big picture’ to understand if certain component gets enough power from the VRM. If a given IC reports an acceptable level of voltage being delivered with a good margin, then we don’t need to dig deeper; we can instead focus on those which may not have good enough margins.

Once we have created all necessary pin groups, we can assign voltage and current sources. There are several ways of doing that (using wizard or manual), for this project we will use ‘Generate Circuit Element on Components’ feature to manually define all sources. Knowing all the components and having pin groups already created makes the assignment very straight-forward. All current sources draw different amount of current, as indicated in our setting, however all current sources have the same Parasitic Resistance (very large value) and all voltage source also have the same Parasitic Resistance (very small value). This is shown on Figure 2 and Figure 3.

Note: The type of the current source ‘Constant Voltage’ or ‘Distributed Current’ matters only if you are assigning a current source to a component with multiple pins on the same net, and since in this project we are working with pins groups, this setting doesn’t make difference in final results.

Fig. 2. Voltage and Current sources assigned
Fig. 3. Parasitic Resistance assignments for all voltage and current sources

For each power net we have created a voltage source on VRM and multiple current sources on ICs and the connector. All sources have a negative node on a GND net, so we have a good common return path. And in addition, we have assigned a negative node of both voltage sources (one for +1.2V and one for +3.3V) as our reference points for our analysis. So reported voltage values will be referenced to that that node as absolute 0V.

At this point, the DC IR setup is complete and ready for simulation.

Results overview and validation

When the DC IR simulation is finished, there is large amount of data being generated, therefore there are different ways of viewing results, all options are presented on Figure 4. In this article I will be primarily focusing on ‘Power Tree’ and ‘Element Data’. As an additional source if validation we may review the currents and voltages overlaying the design to help us to visualize the current flow and power distribution. Most of the time this helps to understand if our assumption of pin grouping is accurate.

Fig. 4. Options to view different aspects of DC IR simulated data

Power Tree

First let’s look at the Power Tree, presented on Figure 5. Two different power nets were simulated, +1.2V and +3.3V, each of which has specified Current Sources where the power gets delivered. Therefore, when we analyze DC IR results in the Power tree format, we see two ‘trees’, one for each power net. Since we don’t have any pins, which would get both 1.2V and 3.3V at the same time (not very physical example), we don’t have ‘common branches’ on these two ‘trees’.

Now, let’s dissect all the information present in this power tree (taking in consideration only one ‘branch’ for simplicity, although the logic is applicable for all ‘branches’):

  • We were treating both power nets +1.2V and +3.3V as separate voltage loops, so we have assigned negative nodes of each Voltage Source as a reference point. Therefore, we see the ‘GND’ symbol ((1) and (2)) for each voltage source. Now all voltage calculations will be referenced to that node as 0V for its specific tree.
  • Then we see the path from Voltage Source to Current Source, the value ΔV shows the Voltage Drop in that path (3). Ultimately, this is the main value power engineers usually are interested in during this type of analysis. If we subtract ΔV from Vout we will get the ‘Actual Voltage’ delivered to the specific current source positive pin (1.2V – 0.22246V = 0.977V). That value reported in the box for the Current Source (4). Technically, the same voltage drop value is reported in the column ‘IR Drop’, but in this column we get more details – we see what the percentage of the Vout is being dropped. Engineers usually specify the margin value of the acceptable voltage drop as a percentage of Vout, and in our experiment we have specified 15%, as reported in column ‘Specification’. And we see that 18.5% is greater than 15%, therefore we get ‘Fail_I_&_V’ results (6) for that Current Source.
  • Regarding the current – we have manually specified the current value for each Current Source. Current values in Figure 2 are the same as in Figure 5. Also, we can specify the margin for the current to report pass or fail. In our example we assigned 108A as a current at the Current Source (5), while 100A is our current limit (4). Therefore, we also got failed results for the current as well.
  • As mentioned earlier, we assigned current values for each Current Source, but we didn’t set any current values for the Voltage Source. This is because the tool calculates how much current needs to be assigned for the Voltage Source, based on the value at the Current Sources. In our case we have 3 Current Sources 108A, 63A, 63A (5). The sum of these three values is 234A, which is reported as a current at the Voltage Source (7). Later we will see that this value is being used to calculate output power at the Voltage Source.  
Fig. 5. DC IR simulated data viewed as a ‘Power Tree’

Element Data

This option shows us results in the tabular representation. It lists many important calculated data points for specific objects, such as bondwire, current sources, all vias associated with the power distribution network, voltage probes, voltage sources.

Let’s continue reviewing the same power net +1.2V and the power distribution to CPU1 component as we have done for Power Tree (Figure 5). The same way we will be going over the details in point-by-point approach:

  • First and foremost, when we look at the information for Current Sources, we see a ‘Voltage’ value, which may be confusing. The value reported in this table is 0.7247V (8), which is different from the reported value of 0.977V in Power Tree on Figure 5 (4). The reason for the difference is that reported voltage value were calculated at different locations. As mentioned earlier, the reported voltage in the Power Tree is the voltage at the positive pin of the Current Source. The voltage reported in Element Data is the voltage at the negative pin of the Current Source, which doesn’t include the voltage drop across the ground plane of the return path.

To verify the reported voltage values, we can place Voltage Probes (under circuit elements). Once we do that, we will need to rerun the simulation in order to get the results for the probes:

  1. Two terminals of the ‘VPROBE_1’ attached at the positive pin of Voltage Source and at the positive pin of the Current Source. This probe should show us the voltage difference between VRM and IC, which also the same as reported Voltage Drop ΔV. And as we can see ‘VPROBE_1’ = 222.4637mV (13), when ΔV = 222.464mV (3). Correlated perfectly!
  2. Two terminals of the ‘VPROBE_GND’ attached to the negative pin of the Current Source and negative pin of the Voltage Source. The voltage shown by this probe is the voltage drop across the ground plane.

If we have 1.2V at the positive pin of VRM, then voltage drops 222.464mV across the power plane, so the positive pin of IC gets supplied with 0.977V. Then the voltage at the Current Source 0.724827V (8) being drawn, leaving us with (1.2V – 0.222464V – 0.724827V) = 0.252709V at the negative pin of the Current Source. On the return path the voltage drops again across the ground plane 252.4749mV (14) delivering back at the negative pin of VRM (0.252709V – 0.252475V) = 234uV. This is the internal voltage drop in the Voltage Source, as calculated as output current at VRM 234A (7) multiplied by Parasitic Resistance 1E-6Ohm (Figure 3) at VRM. This is Series R Voltage (11)

  • Parallel R Current of the Current source is calculated as Voltage 724.82mV (8) divided by Parasitic Resistance of the Current Source (Figure 3) 5E+7 Ohm = 1.44965E-8 (9)
  • Current of the Voltage Source report in the Element Data 234A (10) is the same value as reported in the Power Tree (sum of all currents of Current Sources for the +1.2V power net) = 234A (7). Knowing this value of the current we can multiple it by Parasitic Resistance of the Voltage Source (Figure 3) 1E-6 Ohm = (234A * 1E-6Ohm) = 234E-6V, which is equal to reported Series R Voltage (11). And considering that the 234A is the output current of the Voltage Source, we can multiple it by output voltage Vout = 1.2V to get a Power Output = (234A * 1.2V) = 280.85W (12)
Fig. 6. DC IR simulated data viewed in the table format as ‘Element Data’

In addition to all provided above calculations and explanations, the video below in Figure 7 highlights all the key points of this article.

Fig. 7. Difference between reporting Voltage values in Power Tree and Element Data

Conclusion

By carefully reviewing the Power Tree and Element Data reporting options, we can determine many important decisions about the power delivery network quality, such as how much voltage gets delivered to the Current Source; how much voltage drop is on the power net and on the ground net, etc. More valuable information can be extracted from other DC IR results options, such as ‘Loop Resistance’, ‘Path Resistance’, ‘RL table’, ‘Spice Netlist’, full ‘Report’. However, all these features deserve a separate topic.

As always, if you would like to receive more information related to this topic or have any questions please reach out to us at info@padtinc.com.

Bring Your Simulation Home with Ansys Cloud Solutions – Webinar

Engineering simulation has long been constrained by fixed computing resources available on a desktop or cluster. Today, however, cloud computing can deliver the on-demand, high performance computing (HPC) capacity required for faster high-fidelity results offering greater performance insight, all from the comfort of your home.

Ansys Cloud delivers the speed, power and compute capacity of cloud computing directly to your desktop — when and where you need it. You can run larger, more complex and more accurate simulations to gain more insight into your product — or you can evaluate more design variations to find the optimal design without long hardware/software procurement and deployment delays.

Join PADT’s Senior Application & Simulation Support Engineer Sina Ghods for a look at how Ansys is working to drive adoption by providing users a ready to use cloud service that provides:

  • Higher Fidelity Models
  • Faster Turnaround Time
  • Improved Productivity
  • Flexible Licensing
  • Multiple Supported Solvers
  • And Much More

Register Here

If this is your first time registering for one of our Bright Talk webinars, simply click the link and fill out the attached form. We promise that the information you provide will only be shared with those promoting the event (PADT).

You will only have to do this once! For all future webinars, you can simply click the link, add the reminder to your calendar and you’re good to go!

All Things Ansys 060: Tips For Making Working From Home More Productive

 

Published on: April 6th, 2020
With: Eric Miller & Matt Sutton
Description:  

In this episode your host and Co-Founder of PADT, Eric Miller is joined by PADT’s seasoned expert at working with Ansys from home Matt Sutton for a quick discussion on tips and best practices that make working from home more productive and effective.

If you would like to learn more about how PADT and Ansys can help you to better run your simulation from your home office, check out our webinar on the topic here: https://bit.ly/3dSa8WN

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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All Things Ansys 059: Elements, Contact & Solver Updates in Ansys MAPDL 2020 R1

 

Published on: March 23rd, 2020
With: Eric Miller, Ted Harris, Alex Grishin & Joe Woodward
Description:  

In this episode your host and Co-Founder of PADT, Eric Miller is joined by PADT’s Ted Harris, Alex Grishin, and Joe Woodward to discuss their favorite features in the MAPDL Updates in Ansys 2020 R1.

If you would like to learn more about this topic, you can view PADT’s webinar covering these updates here: https://bit.ly/2WD88vt

Additionally, if you would like to take part in the survey mentioned at the start of the episode click the link here: https://bit.ly/3biWkCp

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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All Things Ansys 058: Combining Mechanical Simulation with Additive Manufacturing

 

Published on: March 9th, 2020
With: Eric Miller, Matt Humrick & Pam Waterman
Description:  

In this episode your host and Co-Founder of PADT, Eric Miller is joined by 3D Printing Applications Engineer Pamela Waterman and Advatech Pacific’s Engineering Manager Matt Humrick for a discussion on real world applications for topology optimization, and it’s value when it comes to creating parts though additive manufacturing.

If you would like to learn more about this topic and what Advatech Pacific is doing, you can download our case study covering these topics here: https://bit.ly/38Bqu2b

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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3D Design Updates in ANSYS 2020 R1 – Webinar

The ANSYS Discovery 3D Design family of products enables CAD modeling and simulation for all design engineers. Since the demands on today’s design engineer to build optimized, lighter and smarter products are greater than ever, using the appropriate design tools is more important than ever. With ANSYS you can explore ideas, iterate, and innovate with unprecedented speed early in your design process. Delve deeper into design details, refine concepts and perform multiple physics simulations — backed by ANSYS solvers — to better account for real-world behaviors.

Capabilities in this tool-set allow engineers to increase speed and reduce costs from the start of the design cycle, all the way to product launch. Improve engineering productivity and accelerate development time, create higher-quality products while reducing development & manufacturing costs, and respond quickly to changing customer demands while bringing new products to market faster than the competition.

Join PADT’s Training & Support Application Engineer, Robert McCathren for a look at whats new & improved when it comes to these tools in ANSYS 2020 R1. This update includes new releases for ANSYS Discovery Live, AIM, and SpaceClaim, focusing on areas including:

  • Simulation of Thin Parts
  • Topology Optimization in Discovery Live
  • Structural Material Properties
  • Physics Aware Meshing
  • Beam and Shell Modeling
  • And much more

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All Things ANSYS 057: Simulation for Additive Manufacturing in ANSYS 2020 R1

 

Published on: February 24th, 2020
With: Eric Miller & Doug Oatis
Description:  

In this episode your host and Co-Founder of PADT, Eric Miller is joined by Lead Mechanical Engineer Doug Oatis for a discussion on the latest advancements in simulation for additive manufacturing and topology optimization in ANSYS 2020 R1.

If you would like to learn more about what this release is capable of, check out our webinar on the topic here:

https://www.brighttalk.com/webcast/15747/384528

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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Additive Manufacturing & Topology Optimization in ANSYS 2020 R1 – Webinar

ANSYS offers a complete simulation workflow for additive manufacturing (AM) that allows you to transition your R&D efforts for metal additive manufacturing into a successful manufacturing operation. This best-in-class solution for additive manufacturing enables simulation at every step in your AM process. It will help you optimize material configurations and machine and parts setup before you begin to print. As a result, you’ll greatly reduce — and potentially eliminate — the physical process of trial-and- error testing.

ANSYS additive solutions continue to evolve at a rapid pace. A variety of new enhancements and features come as part of ANSYS 2020 R1, including the ability to work with EOS printers, using the inherent strain approach in ANSYS Workbench Additive, and new materials in ANSYS Additive Print and Science.

Join PADT’s Lead Mechanical Engineer Doug Oatis for an exploration of the ANSYS tools that help to optimize additive manufacturing, and what new capabilities are available for them when upgrading to ANSYS 2020 R1. This presentation includes updates regarding:

  • Level-set topology optimization
  • Density based topology optimization
  • Inherent strain method in workbench Additive
  • Improved supports in Additive Prep
  • Additive Wizard update
  • And much more

Register Here

If this is your first time registering for one of our Bright Talk webinars, simply click the link and fill out the attached form. We promise that the information you provide will only be shared with those promoting the event (PADT).

You will only have to do this once! For all future webinars, you can simply click the link, add the reminder to your calendar and you’re good to go!

All Things ANSYS 056: A Unique Perspective on a Unique Solution – PADT Sales Talks ANSYS Applications

 

Published on: February 10th, 2020
With: Eric Miller, Bob Calvin, Dan Christensen, Brian Benbow, Heather Dean, Ian Scott & Will Kruspe
Description:  

In this episode your host and Co-Founder of PADT, Eric Miller is joined by Bob Calvin, Dan Christensen, Brian Benbow, Heather Dean, Ian Scott, and Will Kruspe from PADT’s ANSYS sales team to discuss the benefits they see in ANSYS as a solution for their unique customer bases, as well as for manufacturers and engineers as a whole. With a combination of technical know-how and knowledge of positioning within different industries, the PADT sales team shares a unique perspective on the value of the various tools that make up the ANSYS suite and how users can best take advantage of them in order to help them succeed.

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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All Things ANSYS 055: Introducing ANSYS 2020

 

Published on: February 3rd, 2020
With: Eric Miller, Josh Stout, Sina Gohds, Ted Harris & Tom Chadwick
Description:  

In this episode your host and Co-Founder of PADT, Eric Miller is joined by Josh Stout, Sina Gohds, Ted Harris, and Tom Chadwick from the simulation support team to discuss their thoughts on ANSYS 2020 R1, and what specific capabilities they are excited about exploring after attending the annual ANSYS sales kickoff in Florida.

This new release covers updates for the entirety of the ANSYS suite of tools, so there is a lot to talk about.

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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Mechanical Updates in ANSYS 2020 R1 – Webinar

With ANSYS structural analysis software, users are able to solve more complex engineering problems, faster and more efficiently than ever before. Customization and automation of structural solutions is much easier to optimize thanks to new and innovative finite element analysis (FEA) tools available in this product suite.

Once again, ANSYS is able to cement their role as industry leaders when it comes to usability, productivity, and reliability; adding innovative functionality to an already groundbreaking product offering. ANSYS Mechanical continues to be used throughout the industry, and for good reason as it enables engineers to optimize their product design and reduce the costs of physical testing.

Join PADT’s Senior Mechanical Engineer & Lead Trainer Joe Woodward, for an in-depth look at what’s new in the latest version of ANSYS Mechanical, including updates regarding:

  • External Modeling
  • Graphics
  • Composites
  • Linear Dynamics
  • And much more

Register Here

If this is your first time registering for one of our Bright Talk webinars, simply click the link and fill out the attached form. We promise that the information you provide will only be shared with those promoting the event (PADT).

You will only have to do this once! For all future webinars, you can simply click the link, add the reminder to your calendar and you’re good to go!

All Thing ANSYS 054: Talking CFD – Discussion on the Current State of Computational Fluid Dynamics with Robin Knowles

 

Published on: January 13th, 2020
With: Eric Miller & Robin Knowles
Description:  

In this episode we are excited to share an interview done with host and Co-Founder of PADT, Eric Miller and host of the Talking CFD podcast Robin Knowles, regarding the history of PADT’s use of simulation technology as a whole, and the current state of all things CFD.

If you would like to hear more of Robin’s interviews with various other CFD based companies both small and large, you can listen at https://www.cfdengine.com/podcast/.

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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