Thermo-Mechanical Reliability of PCBs

PCB designers know that it is critical to design a board for temperature rise, thermal expansion and external structural loads. The difficulty has always been to capture a board’s structural makeup accurately without having an impractical effect on solve time.

CLICK HERE for a PDF that shows how ANSYS solves this challenge in a unique straightforward and effective manner.  And as always feel free to reach out to us at if you have any questions.