Thermo-Mechanical Reliability of PCBs

PCB designers know that it is critical to design a board for temperature rise, thermal expansion and external structural loads. The difficulty has always been to capture a board’s structural makeup accurately without having an impractical effect on solve time.

CLICK HERE for a PDF that shows how ANSYS solves this challenge in a unique straightforward and effective manner.  And as always feel free to reach out to us at info@padtinc.com if you have any questions.

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