PADT News
ANSYS, Inc. and PADT Team Up; Delivering Mechanical Reliability to
Electronics Packaging
August 9, 2000
SOUTHPOINTE, Pa., Aug. 9 /PRNewswire/ -- ANSYS, Inc. (Nasdaq: ANSS - news), a world leader in advanced computer-aided engineering (CAE) software solutions, and Phoenix Analysis & Design Technologies, Inc. (PADT), specialists in design, analysis, and rapid prototyping, today announced a partnership to supply vertical market applications targeted at the electronics packaging industry.
The partnership’s first endeavor will be AnsPak™, a parametric simulation tool for the chip packaging industry. It is a vertical application that is an add-on tool to the ANSYSŪ product line for the design and mechanical analysis of ball grid array (BGA) packages. The tool is fully parametric with an intuitive, wizard-driven GUI that leads the user through the processes of defining their geometry, building the required 2D or 3D finite element models, conducting a variety of analyses, and the automatic creation of relevant result information. AnsPak can also be used to explore various configurations of BGA geometries from the perspective of joint and die reliability due to thermal loading during manufacturing and operations.
“Electronic package designs are becoming more complex with higher density interconnects and greater diversity in package geometry,” said Paul Lethbridge, Electronics Industry Specialist, ANSYS, Inc. “Our partnership with PADT will create vertical applications that will greatly simplify the analysis process and reduce time-to-market, resulting in increased product quality and reliability.”
“ANSYS is the premier general purpose engineering simulation system,” said Dan Salas, Senior Solution Manager, PADT. “Multiple physical environments can be modeled with ANSYS, including stress, vibration, heat transfer, fluid flow, and electromagnetic fields. PADT uses the complete line of ANSYS products in its day-to-day work of solving real-world engineering problems for our customers, and we have found that ANSYS can solve almost any simulation problem in a timely and accurate manner,” he added.
AnsPak Product Availability
Built as an add-on tool to ANSYS, AnsPak provides engineers with the power to quickly model complex BGA packages and then test the behavior of the critical components in a virtual environment. Version 1.0 of AnsPak is available now and an evaluation version of the tool can be obtained from PADT. More information is available at the AnsPak web site: www.padtinc.com/anspak.
About PADT
Phoenix Analysis and Design Technologies (PADT) is located in the Greater Phoenix, Arizona area. The company delivers technology solutions to the commercial and government marketplaces. PADT’s experienced engineers employ a complete range of the latest tools and techniques to solve tough mechanical engineering problems in a timely and affordable manner. The types of services provided include mechanical design engineering and simulation, rapid prototyping, low volume manufacturing, systems R&D, testing, custom software and productivity solutions. More information on the company and its services can be found on the PADT website at www.padtinc.com.
About ANSYS, Inc.
ANSYS, Inc., headquartered at Southpointe in Canonsburg, Pennsylvania, is committed to providing the highest level of performance on the most advanced simulation applications in the CAE industry. ANSYS, Inc. strives to meet the software requirements for the entire engineering enterprise that is created by today’s competitive marketplace. ANSYS, Inc. partners with leading hardware and software suppliers to provide the best engineering environments available. A global network of ANSYS Support Distributors provides sales, support, and training for customers. Information about ANSYS, Inc. and its products can be found on the ANSYS, Inc. Website at www.ansys.com.
Source: ANSYS, Inc.
