Applied Math Modeling Partners with ANSYS to Distribute and Support CoolSim

Modeling Airflow with CoolSim Improves Data Center Thermal Efficiency, Reduces Costs and Helps Eliminate Heat-Related Equipment Failures

Applied Math Modeling Inc . announced that it has entered into an exclusive agreement with ANSYS, Inc. for the distribution, support and ongoing development of CoolSim TM, a product focused on modeling the thermal environment of data centers. CoolSim is a hosted product that utilizes advanced ANSYS ® CFD solvers to compute the temperature, pressure and airflow within a data center. With the recent increased focus on data center cooling and efficiency, CoolSim has shown to be an effective tool for predicting the effect of changes in the data center.

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