The mechanical analysis of electronic components and systems is diverse and challenging process. The diversity of geometry, loading, and physics all make ANSYS the perfect tool for simulation electronics. In this seminar we will spend some time looking at all the different ways you can use ANSYS to answer questions that arise in the product development process. Topics will include:

• Methods for accurate PCB model building
• Thermal Composite Shells for Through Thickness PCB thermal modeling
• Dynamic analysis of electronic assemblies including PSD analysis
• Modeling methods for BGAs
• Creep analysis of Solder Components
• Electro-Thermal-Mechanical Multiphysics Analysis
• Fluid Solid Interaction Simulation (cooling flow)
• Effective use of Macros for Electronics

This seminar should be a little more interactive than past seminars, and a lot of input from your fellow users is expected.

When: Thursday, August 21, 2003 11:00 AM - 2:00 PM Cost: Free. A light lunch will also be served. Where: PADT's Tempe Office ASU Research Park 7755 S. Research Dr. Suite 110 Tempe, AZ 85284