Whether leveraging improved workflows or leading-edge capabilities with Ansys 2021 R1, teams are tackling design challenges head on, eliminating the need to make costly workflow tradeoffs, developing next-generation innovations with increased speed and significantly enhancing productivity, all in order to deliver high-quality products to market faster than ever.
When it comes to high frequency electromagnetics, Ansys 2021 R1 delivers a plethora of groundbreaking enhancements. Ansys HFSS Mesh Fusion enables simulation of large, never before possible electromagnetic systems with efficiency and scalability. This release also allows for encrypted 3D components supported in HFSS 3D Layout for PCBs, IC packages and IC designs to enable suppliers to share detailed 3D component designs for creating highly accurate simulations.
Join PADT’s Lead Electromagnetics Engineer and high frequency expert Michael Griesi for a presentation on updates made to the Ansys HF suite in the 2021 R1 release, including advancements for:
- Electronics Desktop
- HFSS
- Circuits
- EMIT
- And Much More
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