The high tech electronics and semiconductor industry is under relentless pressure to deliver more capability at lower cost, in a smaller footprint and with lower power requirements.
With 2022 R2, Ansys Electronics solutions continue to bring best-in-class technologies to address PCB, 3D IC package, EMI/EMC, thermal, cabling, and electromechanical design challenges with significant advancements in 5G, autonomous and electrification simulation.
Join PADT’s antenna application engineer and HF/LF expert Alex Moody for a look at what’s new for electromagnetics simulation in Ansys 2022 R2.
This presentation will include enhancements made for:
- HFSS
- EMIT
- Meshing
- Motor CAD
- And Much More
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