Author: Trevor Rubinoff

With CAD-centric (mechanical and electrical CAD) and multiphysics user interfaces, Icepak facilitates the solving of today’s most challenging thermal management problems in electronics products and assemblies. Icepak uses sophisticated CAD healing, simplification and metal fraction algorithms that reduce simulation times, while providing highly accurate solutions that have been validated against real-world products.

This tool provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics solver for thermal and fluid flow analyses of integrated circuits, packages, printed circuit boards, and electronic assemblies.

With the release Ansys 2021 thermal integrity capabilities saw improvements in a variety of areas. Join PADT’s Application & Support Engineer and Thermal Integrity expert Josh Stout to learn more about recent advancements surrounding: 

• Solar Radiation Modeling

     • Robust Meshing Distribution

     • Dynamic Thermal Management

     • The Release of AEDT Mechanical Solutions

     • And Much More

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