In today’s world of high speed communication we are continuously pushing the envelope in data throughput and reliability – There are many challenges that restrict speedy progress: Time – Spinning multiple boards to find and fix problems costs valuable time and money; Cost – additional test procedures can significantly add to this cost; Scalability of Solutions – it’s fundamentally difficult to accurately predict what might happen solely through previous experiences; which is often why multiple spins are required.
ANSYS has the simulation platform that enable signal integrity engineers to predict and improve the performance of high speed communication channels before any board is prototyped – Imagine being able get the design right the first time by testing several design parameters such as different trace routing, power profiles and components.
This sounds like a great proposition but in actuality what do you get from doing that? The answer is a reduced design cost, detailed insight into the design and a reduced time to market. The only way to obtain this “full picture” is to understand the electrical, thermal and mechanical aspects of the design.
A critical characterization in high speed communication channel design is the Eye diagram. Extensive testing is done to obtain Eye diagrams for various signal nets across a PCB or Package – ANSYS can provide the Eye diagram so that engineers can address potential failures and weaknesses in their design before it is sent out for prototyping. Bathtub curves, effects of jitter and identifying crosstalk are equally important in the design of communication channels and all can be obtained and considered with ANSYS tools.
ANSYS supports IBIS-AMI modeling, SERDES design, TDR measurement and Statistical Eye analysis among much more. With chip, memory and board manufacturers all utilizing ANSYS products it is easy to incorporate and analyze real world product performance of the entire PCB.
ANSYS allows all aspects of the design to be tested and optimized before prototyping. Apart from signal integrity ANSYS tools can also accurately model power integrity concerns such as decoupling capacitor optimization, thermal response and structural issues, as well as cooling solutions for chips, packages, PCBs and full electronic systems. With the ability to analyze and help optimize different design characteristics of a PCB, ANSYS can provide engineers with “the full picture” to help reduce cost and time to market, and to understand the design’s expected real world operation.
Top: Voltage Drop; Middle: PCB Warpage;
Bottom: Cooling Flow Through Enclosure
The “Eye” is only a phone call away.
Please give us a call at 1-800-293-PADT or reach out to me directly at email@example.com for more information.