All Things Ansys 088: Taking Simulation To The Moon

 

Published on: May 17th, 2021
With: Eric Miller, Tyler Smith & Connor Nail
Description:  

In this episode your host and Co-Founder of PADT, Eric Miller is joined by Tyler Smith and Connor Nail from the ASU Luminosity Lab to talk about their recent presentation at Ansys Simulation World 2021. A team of students at the ASU Luminosity Lab was awarded funding from NASA to develop a system for exploration of the permanently shadowed regions of the lunar poles.

Through this project titled VELOS (Variable Exploratory Lunar Observation System) the team designed, built, and conducted proof-of-concept testing to successfully validate operation of their prototype system. Learn how Ansys helped make their success possible.

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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Adding a Background Image in Flownex

In this post I will go over what is usually the first step in any Flownex network I build. Adding a background image not only helps me lay out my network but also helps colleagues and clients understand networks at a very quick glance. In this example I am using Flownex version 8.12.7.4334

Choosing an Appropriate Image

The first thing we want to do is to make sure that the image size is such that it’s reasonable in size both resolution-wise (so it doesn’t appear pixelated), and right-size so that components don’t appear too small when placed on top. I recommend something in the multi-thousand of pixels both in width an height. 3000 pixels at a minimum. I usually shoot for around 10,000 wide by 5,000 high if the background image will be landscape. For very complex, large networks, it may make sense to go much larger.

Once we’ve found an appropriate image we will want to make a note of the exact size. This can be found by right-clicking on the image file, selecting properties, and navigating to the details tab.

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Confirming Image Resolution

Resizing Flownex Canvas

The canvas in Flownex can be resized to match this resolution by right-clicking on the canvas, selecting edit page, and populating the correct inputs:

Editing Canvas Inputs

Applying Background Image

The background image can be applied by clicking the radio button next to Style in the Appearance subcategory. Here we will change the Fill Style type to Image, then click the Select Image button:

Styles Editor

The images saved locally to this project will appear here. To add an image we simply click Add Image, navigate to the image of our choice, and click open. Now that it is available as an option we select the image in the Image Selector Gallery and click OK.

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Image Selector Gallery

We can press OK in the Styles Editor to confirm our changes and we should now see our added image as the new background!

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Drawing Canvas with Background Image

Bonus Tips!

  • Adjusting the Fill Style opacity can fade out the background image so that it doesn’t overwhelm the Flownex components placed on top.
  • Turning off the grid under the View ribbon can make the canvas a bit more aesthetically pleasing.

Signal & Power Integrity Updates in Ansys 2021 R1 – Webinar

The use of Ansys Electronics solutions minimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products.

With signal and power integrity (SI & PI) analysis products, users can mitigate many electrical and thermal issues affecting printed circuit boards such as electromagnetic interference, crosstalk, overheating, etc. Ansys integrated electromagnetics and circuit simulation tools are essential for designing high-speed serial channels, parallel buses, and complete power delivery systems found in modern high-speed electronic devices.

Leverage the simulation capability from Ansys to solve the most critical aspects of your designs. Join PADT’s Electronics expert and application engineer Aleksandr Gafarov for a detailed look at what is new for SI & PI in Ansys 2021 R1, including updates available within the following tools:

• SIwave – Granta support & differential time domain crosstalk

• Q3D – Uniform current terminals

• Circuits – Network data explorer & SPISim

• HFSS 3D – Parallel meshing, encrypted 3D components & IC workflow improvements

• Electronics Desktop – Ansys cloud, Minerva & optiSLang integration

• And much more

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All Things Ansys 087: Introducing Rocky DEM – The latest in 3D Discrete Element Modeling Technology

 

Published on: May 3rd, 2021
With: Eric Miller, Robert McCathren, Ahmad Haidari & Marcus Reis
Description:  

In this episode your host and Co-Founder of PADT, Eric Miller is joined by PADT’s Application Engineer, Robert McCathren, as well as Ahmad Haidari – Senior Director of Strategy & Business Development at Rocky DEM, and Marcus Reis – VP of Sales, Support & Marketing at Rocky DEM to discuss the company’s partnership with Ansys and what their tool is capable of.

Rocky is a powerful 3D Discrete Element Modeling (DEM) Particle Simulation Software that quickly and accurately simulates the flow behavior of bulk materials with complex particle shapes and size distributions, for typical applications such as conveyor chutes, mills, mixers, and other materials handling equipment.

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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Simulation Workflow from Ansys Electronic Desktop Circuit to Ansys HFSS

ANSYS Electronics Desktop (AEDT) is a collection of powerful tools for simulation. AEDT Circuit provides time domain as well as frequency domain analyses. AEDT Circuit has high execution speed and robust ability to handle circuits of active and passive elements. Analysis types range from DC, Linear Networks (frequency domain), Transient, Oscillator, TV Noise, Envelope, Harmonic Balance, VerifEye (Statistical Eye Diagram), AMI Analysis, and more, with integrated support for additional co-simulation with tools like HSPICE or Matlab.

AEDT Circuit also provides an easy way to create and simulate planar structures such as microstrip, stripline, coupled lines, co-planar strips, co-planar waveguides, and other Printed Circuit Board (PCB) elements which can then be converted into a physical layout of the PCB. In this blog a simple workflow is explained to generate and model a planar structure in Circuit, then export the circuit model to HFSS 3D layout and HFSS for further analysis.

Define your substrate:

After inserting a Circuit Design, right-click on Data under project tree, choose Add Substrate Definition. This brings you to Substrate Defintion window that gives you many optios of substate types. You can choose the type of substarte you need and enter the dielectric and trace metalization information as shown in Figure 1. This substrate is used in calucalation of line impedances.

(a)

(b)

Figure 1. (a) Substrate Definition options of substrate types, (b) the definition of strapline used in this blog.

Define your stackup:

The stackup in Circuit is very similar to the stackup in HFSS 3D Layout. Please note that the definition of substrate is not automatically transferred to the stackup. The stackup needs to be defined by the user. Select the Schematic tab and from the top banner choose Stackup. Then define each layer. This stackup will be used in creating the layout and transferring it to HFSS 3D Layout.  Figure 2 shows the stackup used for the FR4 substrate that was defined in Figure 1(b).

Figure 2. Stackup definition that will be used to transfer the layout to HFSS 3D Layout.

Create the circuit:

Circuit provides a large selection of component libraries. To see the Component Libraries, click on View and check Component Libraries. In the Component Libraries window look for Distributed and expand it. Under this category you see different types of PCB structures. We will use Stripline library. Expanding Stripline library there are various categories, including Transmission Lines. We need Transmission Line Physical Length component, as we would like to use pieces of transmission line to create an ideal branch line coupler. You notice by hovering the cursor on the name of the component a small information windows shows the symbol and information about the component, alternatively you can right-click on the name of the component and choose “View Component Help” to get to the complete help page about the component. Once a component is selected and placed in the circuit it will also appear under the Project Components list at the bottom of the Component Libraries list. This provides a quick way to reuse them (Figure 3).

Figure 3. (a) Component Libraries, (b) Project Components and information window.

Let’s choose a physical length transmission line and place it on the schematic window. By double clicking on the symbol the Properties window opens and can be modified. Explicit values or parameters can be used to define the line properties.

Are you starting to calculate the line impedance to figure out the dimensions? Wait, there is a tool here that helps you do that. Click on TRL to open the line calculator. The line can be synthesized based on its impedance and electrical size by choosing the correct frequency and clicking on Synthesize (Figure 4). Using physical length transmission lines (50 and 35 ohms) and Tee lines and 4 ports I created an ideal branch line coupler (Figure 5). I ran a frequency analysis to make sure the circuit is working properly.

Before moving on to export the layout to HFSS 3D layout we can do one more step. To keep the substrate definition and reuse it layer, click on File->Save As Technology File. This would save the definition of stripline substrate in the personal library. Next step is to export the layout to HFSS 3D layout.

Figure 4. Properties and TRL windows.

Figure 5. Branch line coupler schematic.

Export to HFSS 3D Layout:

Under Schematic tab, click on Layout, or from the top menu choose Circuit->Layout Editor. Notice that this layout editor is very similar to the HFSS 3D Layout window. Click Ctrl+A, to select everything. Then choose Draw form the top banner and click on Align MW Ports (Figure 6), notice that other tools are also available under Draw, such as Sanitize Layout and Geometry Healing. You might need to do a bit more corrections and cleaning before exporting the layout. Before exporting the geometry, you can also check the HFSS Airbox using Layout->Draw HFSS Airbox.

Figure 6. Aligning ports.

You may change the orientation to Isometric for a better view of the box (Figure 7).

Figure 7. Layout editor in Isometric orientation, showing the HFSS airbox.

Make sure everything is still selected or select them with Ctrl+A, then under Edit, choose Copy to HFSS 3D Layout.  Now an HFSS 3D Layout design is created. Open the design. There might be a few things you like to change. Expand the ports, the name of the ports might have changed. You also note that the ports are of Gap type. You can select the port and in the Properties window, under HFSS click on Gap and choose the Wave port. Just note that the wave port cannot be internal to the design. You might need to adjust the air box size or create PEC port caps in HFSS later.

The second point to consider is about the parameters defined in Circuit. Remember that we defined W35 and W50 as the line widths in Circuit. The parameter are transferred but several local variables are also created based on them. For example click on the 50 ohm line. The width is now shown as a new parameter. You can see the complete list of parameters that are created by choosing HFSS 3D Layout->Design Parameters. Under the Parameters Default you still see W35 and W50, but moving to Local Variables tab you see the parameters created based on the Parameters Default.

Figure 8. Properties window.

Export to HFSS:

Any HFSS 3D Layout design can be exported to HFSS. Click on Analysis from the project three. Right-click and Add HFSS Solution Setup (Figure 9). There is no need to run this analysis. It just needs to be created. Right-click on the HFSS Setup that was just created, select Export->HFSS Model (Figure 10). Select the name and location for this file. Open this file and examine the model. Notice that the parameters are not transferred to HFSS model, this is because all parts of the model are imported (Figure 11). The default ports (Gap ports) appear as lumped port. If you changed the Gap ports to Wave ports in HFSS 3D Layout, it is now the time to add the PEC port caps or change the airbox to make sure ports are not internal to the model.

Figure 9. Adding HFSS solution setup.

Figure 10. Exporting the layout to an HFSS model.

Figure 11. HFSS model.

It is important to note that the type of analysis in Circuit is different than HFSS which will lead to slightly different result (Figure 12), which is expected and emphasizes the value of simulating structures in a full-wave field simulator like HFSS.

(a)

(b)

Figure 12. (a) Branch-line coupler S parameters from Circuit model, (b) the imported HFSS branch-line coupler S parameters.

Conclusion

This was a short blog showing the workflow for importing PCB and planar designs from AEDT Circuit to HFSS 3D Layout and HFSS. The workflow is a good method to quickly create the HFSS model of a planar structure.

If you would like more information related to this topic or have any questions, please reach out to us at info@padtinc.com.

Electronics Reliability Updates in Ansys 2021 R1 – Webinar

Best practices for ensuring and predicting electronics reliability require comprehensive multi-physics simulations. Ansys ensures reliability success by developing solutions and workflows that overcome today’s biggest simulation and design challenges. 

With Ansys 2021 R1, electronics reliability became much easier to manager with advanced capabilities for design democratization, workflow automation, and robust reliability predictions. Along with these updated components, users can better access integrated workflows between Ansys Sherlock, Icepak, Mechanical, LS-Dyna, and more to provide the results necessary to optimize product designs and ensure unparalleled reliability in the field. 

Join PADT’s Systems Application & Support Engineer Josh Stout for a presentation covering updates to existing features and the introduction of new tools available in this latest release. Learn how users can:

• Extract detailed geometries from any ECAD file

     • Predict time to failure before prototyping

     • Perform complex multiphysics analyses

     • Implement automation and optimization 

     • And much more

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All Things Ansys 086: Thermal Integrity in Ansys 2021 R1

 

Published on: April 20th, 2021
With: Eric Miller & Josh Stout
Description:  

In this episode your host and Co-Founder of PADT, Eric Miller is joined by PADT’s Systems Application & Support Engineer, Josh Stout in order to discuss what is new with regards to thermal integrity in Ansys 2021 R1.

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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Mechanical Analysis Updates in Ansys 2021 R1 – Webinar

Ansys 2021 R1 delivers significant improvements in simulation technology together with nearly unlimited computing power to help engineers across all industries reimagine product design and achieve product development goals that were previously thought impossible. 

With updates made to Ansys mechanical, users can easily handle the complexity of a variety of design environments. Everything from mulitphysics analysis to dynamic simulation allows for the ability to create a product that meets performance goals and holds up over time. 

Join PADT’s Application Engineer Robert McCathren for a look at analytical advancements in Ansys Mechanical 2021 R1, including updates for: 

          ​​​​• Element Technology

          • NonLinear Adaptivity

          • Coupled Physics Analysis

          • Linear Dynamics

          • Contact

          • And much more

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All Things Ansys 085: Additive & Structural Optimization Updates in Ansys 2021 R1

 

Published on: April 5th, 2021
With: Eric Miller & Doug Oatis
Description:  

In this episode your host and Co-Founder of PADT, Eric Miller is joined by PADT’s Lead Mechanical Engineer, Doug Oatis in order to discuss what is new with regards to additive and structural optimization in Ansys 2021 R1.

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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Thermal Integrity Updates in Ansys 2021 R1 – Webinar

With CAD-centric (mechanical and electrical CAD) and multiphysics user interfaces, Icepak facilitates the solving of today’s most challenging thermal management problems in electronics products and assemblies. Icepak uses sophisticated CAD healing, simplification and metal fraction algorithms that reduce simulation times, while providing highly accurate solutions that have been validated against real-world products.

This tool provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics solver for thermal and fluid flow analyses of integrated circuits, packages, printed circuit boards, and electronic assemblies.

With the release Ansys 2021 thermal integrity capabilities saw improvements in a variety of areas. Join PADT’s Application & Support Engineer and Thermal Integrity expert Josh Stout to learn more about recent advancements surrounding: 

• Solar Radiation Modeling

     • Robust Meshing Distribution

     • Dynamic Thermal Management

     • The Release of AEDT Mechanical Solutions

     • And Much More

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All Things Ansys 084: The State of Mechanical Meshing in Ansys 2021

 

Published on: March 22nd, 2021
With: Eric Miller & Joe Woodward
Description:  

In this episode your host and Co-Founder of PADT, Eric Miller is joined by PADT’s Senior Mechanical Engineer and Lead Trainer, Joe Woodward in order to discuss what new mechanical meshing capabilities are available in Ansys 2021.

Meshing is an integral part of the engineering simulation process where complex geometries are divided into simple elements that can be used as discrete local approximations of the larger domain. The mesh influences the accuracy, convergence and speed of the simulation. Furthermore, since meshing typically consumes a significant portion of the time it takes to get simulation results, the better and more automated the meshing tools, the faster and more accurate the solution.

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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Additive & Structural Optimization Updates in Ansys 2021 R1 – Webinar

The most powerful simulation solution for metal additive manufacturing, the Ansys Additive Suite delivers the critical insights required by designers, engineers and analysts to avoid build failure and create parts that accurately conform to design specifications. This comprehensive solution spans the entire workflow — from design for additive manufacturing (DfAM) through validation, print design, process simulation and exploration of materials.

Ansys 2021 R1 delivers enhancements across all portfolio products — Ansys Additive Prep, Ansys Additive Print, Ansys Additive Science and Ansys Workbench Additive — empowering users to further advance their additive manufacturing capabilities.

Join PADT’s Simulation Support & Application Engineer Doug Oatis for a webinar covering both the structural optimization and additive updates made to Ansys 2021 R1 including enhancements for: 

  • Process Simulation

  • Part Qualification

  • Design for AM

  • Build Setup

  • Shape & Lattice Optimization

  • And much more

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All Things Ansys 083: Digital Mission Engineering & the Acquisition of AGI

 

Published on: March 8th, 2021
With: Eric Miller, Anthony Dawson & Paul Graziani
Description:  

In this episode your host and Co-Founder of PADT, Eric Miller is joined by Anthony Dawson, Vice President & General Manager at Ansys, and Paul Graziani, CEO and Co-Founder of Analytical Graphics, Inc. (AGI) to discuss the acquisition of AGI and what it means for those simulating in the aerospace and defense industry.

Digital mission engineering, pioneered by AGI, combines digital modeling, simulation, testing, and analysis for aerospace, defense, telecommunication, and intelligence applications to evaluate mission outcomes at every phase of a system’s life cycle. Using this tool you can evaluate the full effect of every change you make and find problems before they become crises.

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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The State of Mechanical Meshing in Ansys 2021 R1 – Webinar

Meshing is an integral part of the engineering simulation process where complex geometries are divided into simple elements that can be used as discrete local approximations of the larger domain. The mesh influences the accuracy, convergence and speed of the simulation. Furthermore, since meshing typically consumes a significant portion of the time it takes to get simulation results, the better and more automated the meshing tools, the faster and more accurate the solution.

Ansys provides general purpose, high-performance, automated, intelligent meshing software which produces the most appropriate mesh for accurate, efficient multiphysics solutions — from easy, automatic meshing to highly crafted mesh. 

Join PADT’s Senior Mechanical Engineer and meshing expert Joe Woodward for an introduction to the new meshing capabilities available in Ansys 2021 R1, including updates for: 

• Repairing Topology

• Weld Control

• Separating Morphing Adaptive Remeshing Technology (SMART)

• Batch Connections

• And much more

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All Things Ansys 082: High Frequency Updates on Ansys 2021 R1

 

Published on: February 26th, 2021
With: Eric Miller & Aleksandr Gafarov
Description:  

In this episode your host and Co-Founder of PADT, Eric Miller is joined by PADT’s Electronics Application Engineer Aleksandr Gafarov for a look at what’s new in this electromagnetics release.

When it comes to high frequency electromagnetics, Ansys 2021 R1 delivers a plethora of groundbreaking enhancements. Ansys HFSS Mesh Fusion enables simulation of large, never before possible electromagnetic systems with efficiency and scalability.

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at podcast@padtinc.com we would love to hear from you!

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