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Optimize Your Workflow with PowderEase™ T1
Simplify your additive manufacturing process by automating powder breakout, retrieval, and dosing. This 3-in-1 solution reduces manual handling, optimizes powder usage, and enables scalable production while ensuring clean, controlled workflows.
Increase Efficiency, Lower Costs
Save up to 50 minutes per build by automating timeconsuming processes. T1 ensures efficient powder removal, consistent dosing and efficient mixing of used and virgin powders, enhancing productivity and powder recovery.
Scale for Multiple Printers
Designed for high-volume environments, a single PowderEase T1 can comfortably support up to six H350™ printers using the same material, cutting operational costs and increasing uptime.
Optimize Your Workflow with PowderEase™ T1
Simplify your additive manufacturing process by automating powder breakout, retrieval, and dosing. This 3-in-1 solution reduces manual handling, optimizes powder usage, and enables scalable production while ensuring clean, controlled workflows.
Increase Efficiency, Lower Costs
Save up to 50 minutes per build by automating timeconsuming processes. T1 ensures efficient powder removal, consistent dosing and efficient mixing of used and virgin powders, enhancing productivity and powder recovery.
Scale for Multiple Printers
Designed for high-volume environments, a single PowderEase T1 can comfortably support up to six H350™ printers using the same material, cutting operational costs and increasing uptime.
| Build Size | 490 x 390 x 200 mm (19.3 x 15.35 x 7.9 in.) |
|---|---|
| Layer Thickness | Horizontal build layers down to 14 microns (0.00055 in.) 55 microns (0.002 in.) in Super High Speed mode |
| System Size and Weight | J850 Pro/J850 Prime System: 1400 x 1260 x 1100 mm (55.1 x 49.6 x 43.4 in.); 430 kg (948 lbs.), J850 Pro/J850 Prime Material Cabinet: 1119 x 656 x 637 mm (44 x 25.8 x 25.1 in.); 153 kg |
| Workstation Compatibility | Windows 10 |
| Network Connectivity | LAN – TCP/IP |
| Software | GrabCAD Print |
| Operating Conditions | Temperature 18 – 25 °C (64 – 77 °F); relative humidity 30-70% (non-condensing) |
| Power Requirements | 100–120 VAC, 50–60 Hz, 13.5 A, 1 phase 220–240 VAC, 50–60 Hz, 7 A, 1 phase |
| Regulatory Compliance | CE, FCC, EAC, RCM, R-NZ1 |
| Build Modes | High Quality: up to 7 base resins, 14-micron (0.00055 in.) resolution High Mix: up to 7 base resins, 27-micron (0.001 in.) resolution High Speed: up to 3 base resins, 27-micron (0.001 in.) resolution Super High Speed: 1 base resin, 55 micron (0.002 in.) resolution |
| Accuracy | Typical deviation from STL dimensions, for models printed with rigid materials, based on size: under 100 mm – ±100μ; above 100 mm – ±200μ or ± 0.06% of part length, whichever is greater |
