ANSYS Icepak

ANSYS Icepak software provides robust and powerful computational fluid dynamics (CFD) for electronics thermal management. Based on the renowned ANSYS FLUENT solver, ANSYS Icepak combines advanced solver technology with robust meshing options designed to provide fast and accurate thermal results for electronics cooling applications

For more than a decade, companies around the world have relied on ANSYS Icepak to carry out rapid heat transfer and fluid flow analysis of IC packages, printed circuit boards and complete electronic system as well as to perform easy validation of design modifications before building any physical prototypes.

Contact PADT to have our engineers work with you to see how ANSYS Icepak can model and solve your electronic thermal management issues.

Key Features

  • Object oriented approach to building models , allowing drag and drop construction
  • Integration with all major mechanical and electronic CAD systems for simplified geometry import
  • Flexible, Automatic Meshing
  • Built on the industry leading solver, ANSYS FLUENT
  • Specialized result visualization and interrogation tools
  • Automatic calculation of thermal conductivity in PCB boards
  • Integration with ANSYS SIwave to accurately predict heating due to conductive losses
  • Integration with ANSYS Mechanical products for component and system level thermal and thermal stress simulation
  • Macros that automate common modeling tasks
  • Built in libraries for materials as well as for fans, heatsinks, packages, and other standard electronic components.
  • Highly scalable parallel solving

This is a very diverse product offering with outstanding breadth and depth, which makes it very difficult to describe in a series of web pages.  Please contact us and our experts can help you, based on what your needs are, discover which ANSYS, Inc. products best meet those needs.

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