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Taking risks attempting to capture design intent at the end of the process requires a lot of post-processing (coloring, assemblies, a mix of technologies, etc.) – when its too time consuming, expensive and late to make changes or correct errors. Stratasys PolyJet 3D printing technology is developed to elevate designs by realizing ideas more quickly and more accurately and taking color copies to the next level.
By putting realistic models in a designer’s hands earlier in the process, companies can promote better decisions and a superior final product. Now, with the Stratasys J8 Series, the same is true for prototypes. This tried and tested technology simplifies the entire design process, streamlining workflows so you can spend more time on what matters –creating, refining, and designing the best product possible.
PADT is excited to introduce the new Stratasys J826 3D printer
Based on J850 technology, the J826 supplies the same end-to-end solution for the design process and ultra-realistic simulation at a lower price point.
Better communicate design intent and drive more confident results with prototypes that realistically portray an array of design alternatives.
The Stratasys J826 3D Printer is able to deliver realism, shorter time to market, and streamlined application thanks to a variety of unique attributes that set it apart from most other Polyjet printers:
Are you ready to learn how the new Stratasys J826 provides the same quality and accuracy as other J8 series printers at a lower cost?
Provide the requested information via the form linked below and one of PADT’s additive experts will reach out to share more on what makes this new offering so exciting for the enterprise design world.
Recently the ‘Signal Integrity Journal’ posted their ‘Top 10 Articles’ of 2019. All of the articles included were incredible, however, one stood out to me from the rest – ‘Seven Habits of Successful 2-Layer Board Designers’ by Dr. Eric Bogatin (https://www.signalintegrityjournal.com/blogs/12-fundamentals/post/1207-seven-habits-of-successful-2-layer-board-designers). In this work, Dr. Bogatin and his students were developing a 2-Layer printed circuit board (PCB), while trying to minimize signal and power Integrity issues as much as possible. As a result, they developed a board and described seven ‘golden habits’ for this board development. These are fantastic habits that I’m confident we can all agree with. In particular, there was one habit at which I wanted to take a deeper look:
“…Habit 4: When you need to route a cross-under on the bottom layer, make it short. When you can’t make it short, add a return strap over it..”
Generally speaking, this habit suggests to be very careful with the routing of signal traces over the gap on the ground plane. From the signal integrity point of view, Dr. Bogatin explained it perfectly – “..The signal traces routed above this gap will see a gap in the return path and generate cross talk to other signals also crossing the gap..”. On one hand, crosstalk won’t be a problem if there are no other nets around, so the layout might work just fine in that case. However, crosstalk is not the only risk. Fundamentally, crosstalk is an EMI problem. So, I wanted to explore what happens when this habit is ignored and there are no nearby nets to worry about.
To investigate, I created a simple 2-Layer board with the signal trace, connected to 5V voltage source, going over an air gap. Then I observed the near field and far field results using ANSYS SIwave solution. Here is what I found.
Typically, near and far fields are characterized by solved E and H fields around the model. This feature in ANSYS SIwave gives the engineer the ability to simulate both E and H fields for near field analysis, and E field for Far Field analysis.
First and foremost, we can see, as expected, that both near and far Field have resonances at the same frequencies. Additionally, we can observe from Figure 1 that both E and H fields for near field have the largest radiation spikes at 786.3 MHz and 2.349GHz resonant frequencies.
Figure 1. Plotted E and H fields for both Near and Far Field solutions
If we plot E and H fields for Near Field, we can see at which physical locations we have the maximum radiation.
Figure 2. Plotted E and H fields for Near field simulations
As expected, we see the maximum radiation occurring over the air gap, where there is no return path for the current. Since we know that current is directly related to electromagnetic fields, we can also compute AC current to better understand the flow of the current over the air gap.
This feature has a very simple setup interface. The user only needs to make sure that the excitation sources are read correctly and that the frequency range is properly indicated. A few minutes after setting up the simulation, we get frequency dependent results for current. We can review the current flow at any simulated frequency point or view the current flow dynamically by animating the plot.
Figure 3. Computed AC currents
As seen in Figure 3, we observe the current being transferred from the energy source, along the transmission line to the open end of the trace. On the ground layer, we see the return current directed back to the source. However at the location of the air gap there is no metal for the return current to flow, therefore, we can see the unwanted concentration of energy along the plane edges. This energy may cause electromagnetic radiation and potential problems with emission.
If we have a very complicated multi-layer board design, it won’t be easy to simulate current flow on near and far fields for the whole board. It is possible, but the engineer will have to have either extra computing time or extra computing power. To address this issue, SIwave has a feature called EMI Scanner, which helps identify problematic areas on the board without running full simulations.
ANSYS EMI Scanner, which is based on geometric rule checks, identifies design issues that might result in electromagnetic interference problems during operation. So, I ran the EMI Scanner to quickly identify areas on the board which may create unwanted EMI effects. It is recommended for engineers, after finding all potentially problematic areas on the board using EMI Scanner, to run more detailed analyses on those areas using other SIwave features or HFSS.
Currently the EMI Scanner contains 17 rules, which are categorized as ‘Signal Reference’, ‘Wiring/Crosstalk’, ‘Decoupling’ and ‘Placement’. For this project, I focused on the ‘Signal Reference’ rules group, to find violations for ‘Net Crossing Split’ and ‘Net Near Edge of Reference’. I will discuss other EMI Scanner rules in more detail in a future blog (so be sure to check back for updates).
Figure 4. Selected rules in EMI Scanner (left) and predicted violations in the project (right)
As expected, the EMI Scanner properly identified 3 violations as highlighted in Figure 4. You can either review or export the report, or we can analyze violations with iQ-Harmony. With this feature, besides generating a user-friendly report with graphical explanations, we are also able to run ‘What-if’ scenarios to see possible results of the geometrical optimization.
Figure 5. Generated report in iQ-Harmony with ‘What-If’ scenario
Based on these results of quick EMI Scanner, the engineer would need to either redesign the board right away or to run more analysis using a more accurate approach.
In this blog, we were able to successfully run simulations using ANSYS SIwave solution to understand the effect of not following Dr.Bogatin’s advice on routing the signal trace over the gap on a 2-Layer board. We also were able to use 4 different features in SIwave, each of which delivered the correct, expected results.
Overall, it is not easy to think about all possible SI/PI/EMI issues while developing a complex board. In these modern times, engineers don’t need to manufacture a physical board to evaluate EMI problems. A lot of developmental steps can now be performed during simulations, and ANSYS SIwave tool in conjunction with HFSS Solver can help to deliver the right design on the first try.
If you would like more information or have any questions please reach out to us at info@padtinc.com.
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Environmental pollution has been a fact of life for many centuries, though it became a real issue after the start of the industrial revolution. An estimated 6.5 million premature deaths have been linked to air pollution every year.
In order to properly combat this growing issue, the world’s leading minds have turned to a more effective tool for environmental analysis; numerical simulation. Computational fluid dynamics has proven to be a powerful tool when it comes to predicting and controlling air, water, and noise pollution. Saab Bio Power can guide you more to measure and control pollution.
Join PADT’s CFD Team Lead Engineer Clinton Smith to learn how ANSYS fluid mechanics solutions provide insight and detailed understanding of the formation and dispersion of pollutants such as NOx, SOx, CO & Soot as well as effective ways for modelling pollution control equipment such as ESP’s, bag filters, and wastewater treatment plants.
If this is your first time registering for one of our Bright Talk webinars, simply click the link and fill out the attached form. We promise that the information you provide will only be shared with those promoting the event (PADT).
You will only have to do this once! For all future webinars, you can simply click the link, add the reminder to your calendar and you’re good to go!
ANSYS offers a complete simulation workflow for additive manufacturing (AM) that allows you to transition your R&D efforts for metal additive manufacturing into a successful manufacturing operation. This best-in-class solution for additive manufacturing enables simulation at every step in your AM process. It will help you optimize material configurations and machine and parts setup before you begin to print. As a result, you’ll greatly reduce — and potentially eliminate — the physical process of trial-and- error testing.
Through the use of ANSYS tools such as Additive Prep, Print, and Science, paired with topology optimization capabilities in ANSYS Mechanical Workbench, the need for physical process of trial-and-error testing has been greatly reduced.
Join PADT’s Simulation Support and Application Engineer Doug Oatis for an exploration of the ANSYS tools that help to optimize additive manufacturing, and what new capabilities are available for them when upgrading to ANSYS 2019 R3. This presentation includes updates regarding:
If this is your first time registering for one of our Bright Talk webinars, simply click the link and fill out the attached form. We promise that the information you provide will only be shared with those promoting the event (PADT).
You will only have to do this once! For all future webinars, you can simply click the link, add the reminder to your calendar and you’re good to go!
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ANSYS 2019 R3 brings a whole host of improvements to various mechanical features, designed to enhance overall optimization and ease of use. Key updates such as those made in regards to the mechanical solver, MAPDL elements, and contact modeling capabilities help make this release essential for performing effective analyses, and deriving valuable results from said analyses.
For example, being able to simulate contact correctly means that engineers can simulate the change in load paths when parts deform and confidently predict how assemblies will behave in the real world.
Join PADT’s Simulation Support Manager Ted Harris, for a look at the latest mechanical solver, element, and contact updates available in ANSYS 2019 R3. This presentation includes enhancements made for:
Improved scaling for various solvers
Surface stress evaluation for axisymmetric solid elements
Piezoelectric analyses
Nonlinear radial gap elements
And much more
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With ANSYS structural analysis software, users are able to solve more complex engineering problems, faster and more efficiently than ever before. Customization and automation of structural solutions is much easier to optimize thanks to new and innovative finite element analysis (FEA) tools available in this product suite.
Once again, ANSYS is able to cement their role as industry leaders when it comes to usability, productivity, and reliability; adding innovative functionality to an already groundbreaking product offering. ANSYS structural analysis software continues to be used throughout the industry, and for good reason as it enables engineers to optimize their product design and reduce the costs of physical testing.
Join PADT’s Specialist Mechanical Engineer Joe Woodward, for an in-depth look at what’s new in the latest version of ANSYS Mechanical, including updates regarding:
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Additive manufacturing (3D Printing) has been rapidly gaining popularity as a true manufacturing process in recent years. ANSYS’ best-in-class solution for additive manufacturing enables simulation at every step in your AM process, and helps to optimize material configurations, and machine & parts setup before printing begins.
Through the use of ANSYS tools such as Additive Suite & Additive Print, paired with topology optimization capabilities in ANSYS Mechanical Workbench, the need for physical process of trial-and-error testing has been greatly reduced.
Join PADT’s Simulation Support and Application Engineer Doug Oatis for an exploration of the ANSYS tools that help to optimize additive manufacturing, and what new capabilities are available within them when upgrading to ANSYS 2019 R2. This presentation includes updates regarding:
If this is your first time registering for one of our Bright Talk webinars, simply click the link and fill out the attached form. We promise that the information you provide will only be shared with those promoting the event (PADT).
You will only have to do this once! For all future webinars, you can simply click the link, add the reminder to your calendar and you’re good to go!
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ANSYS CFD goes beyond qualitative results to deliver accurate quantitative predictions of fluid interactions and trade-offs. These insights reveal unexpected opportunities for your product — opportunities that even experienced engineering analysts can miss.
Products such as ANSYS Fluent, Polyflow, and CFX work together in a constantly improving tool kit that is developed to provide ease of use improvements for engineers simulating fluid flows and it’s impacts on physical models.
Join PADT’s Simulation Support and Application Engineer, Sina Ghods, for a look at what is new and improved for fluids-related tools in ANSYS 2019 R2. This presentation includes updates regarding:
A new fluent experience
Parallel Mosaic-enabled meshing
Discrete Phase Modeling
Creating high-quality meshes for complex models
Transient elasticity for fluid structure interaction
And much more
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When it comes to the exploration of rapid 3D design, simulation provides a more efficient and optimized workflow for design engineers looking to streamline product development and improve product performance. The toolkit of flagship ANSYS 3D design products made up of Discovery SpaceClaim, Discovery Live, and Discovery AIM allow users to build, and optimize lighter and smarter products with an interface easier to use than most other simulation products.
Users can delve deeper into the details of a design with the same accuracy as other, more robust ANSYS tools, all while refining their concept and introducing multiple physics simulations to better account for real-world conditions.
Join PADT’s Simulation Support Manager Ted Harris, for a look at what’s new for this line of products with the release of ANSYS 2019 R2. Explore updates for these three tools including:
If this is your first time registering for one of our Bright Talk webinars, simply click the link and fill out the attached form. We promise that the information you provide will only be shared with those promoting the event (PADT).
You will only have to do this once! For all future webinars, you can simply click the link, add the reminder to your calendar and you’re good to go!