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Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI).
Perform conduction, convection and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Key functionality includes:
With CAD-centric (mechanical and electrical CAD) and multiphysics user interfaces, Icepak facilitates the solving of today’s most challenging thermal management problems in electronics products and assemblies. Icepak uses sophisticated CAD healing, simplification and metal fraction algorithms that reduce simulation times, while providing highly accurate solutions that have been validated against real-world products. The solution’s high degree of accuracy results from the highly automated, advanced meshing and solver schemes, which ensure a true representation of the electronics application.
Icepak includes all modes of heat transfer — conduction, convection and radiation — for steadystate and transient electronics cooling applications.
Ansys – PADT
Main Office:
ASU Research Park
7755 S Research Dr
Suite 110
Tempe, AZ 85284
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Suite 550
Lakewood, CO 80228
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1451 Innovation Pkwy SE
Suite 402
Albuquerque, NM 87123
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