Signal & Power Integrity Updates in Ansys 2021 R1 – Webinar

The use of Ansys Electronics solutions minimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products.

With signal and power integrity (SI & PI) analysis products, users can mitigate many electrical and thermal issues affecting printed circuit boards such as electromagnetic interference, crosstalk, overheating, etc. Ansys integrated electromagnetics and circuit simulation tools are essential for designing high-speed serial channels, parallel buses, and complete power delivery systems found in modern high-speed electronic devices.

Leverage the simulation capability from Ansys to solve the most critical aspects of your designs. Join PADT’s Electronics expert and application engineer Aleksandr Gafarov for a detailed look at what is new for SI & PI in Ansys 2021 R1, including updates available within the following tools:

• SIwave – Granta support & differential time domain crosstalk

• Q3D – Uniform current terminals

• Circuits – Network data explorer & SPISim

• HFSS 3D – Parallel meshing, encrypted 3D components & IC workflow improvements

• Electronics Desktop – Ansys cloud, Minerva & optiSLang integration

• And much more

Register Here

If this is your first time registering for one of our Bright Talk webinars, simply click the link and fill out the attached form. We promise that the information you provide will only be shared with those promoting the event (PADT).

You will only have to do this once! For all future webinars, you can simply click the link, add the reminder to your calendar and you’re good to go!

High Frequency Updates in Ansys 2021 R1 – Webinar

Whether leveraging improved workflows or leading-edge capabilities with Ansys 2021 R1, teams are tackling design challenges head on, eliminating the need to make costly workflow tradeoffs, developing next-generation innovations with increased speed and significantly enhancing productivity, all in order to deliver high-quality products to market faster than ever.

When it comes to high frequency electromagnetics, Ansys 2021 R1 delivers a plethora of groundbreaking enhancements. Ansys HFSS Mesh Fusion enables simulation of large, never before possible electromagnetic systems with efficiency and scalability. This release also allows for encrypted 3D components supported in HFSS 3D Layout for PCBs, IC packages and IC designs to enable suppliers to share detailed 3D component designs for creating highly accurate simulations.

Join PADT’s Lead Electromagnetics Engineer and high frequency expert Michael Griesi for a presentation on updates made to the Ansys HF suite in the 2021 R1 release, including advancements for:

  • Electronics Desktop
  • HFSS
  • Circuits
  • EMIT
  • And Much More

Register Here

If this is your first time registering for one of our Bright Talk webinars, simply click the link and fill out the attached form. We promise that the information you provide will only be shared with those promoting the event (PADT).

You will only have to do this once! For all future webinars, you can simply click the link, add the reminder to your calendar and you’re good to go!

High Frequency Electromagnetic Updates in ANSYS 2019 R2 – Webinar

HFSS (High Frequency Structure Simulator) employs versatile solvers and an intuitive GUI to provide unparalleled performance, as well as deep insight, into a wide variety of 3D electromagnetic (EM) problems. ANSYS HFSS is the premier EM tool for R&D and virtual design prototyping. It reduces design cycle time and boosts your product’s reliability and performance. 

The ANSYS HFSS simulation suite consists of a comprehensive set of solvers to address diverse electromagnetic problems, ranging in detail and scale from passive IC components to extremely large-scale EM analyses. Its reliable automatic adaptive mesh refinement allows users to focus on the design instead of spending time determining and creating the best mesh.

Join PADT’s Lead Electromagnetics Engineer Michael Griesi for a look at what new capabilities are available for HFSS users in ANSYS 2019 R2.

This presentation will include updates for the following topics:

  • Solve speed
  • Electronics Desktop
  • ANSYS Cloud
  • Post processing
  • And much more

Register Here

If this is your first time registering for one of our Bright Talk webinars, simply click the link and fill out the attached form. We promise that the information you provide will only be shared with those promoting the event (PADT).

You will only have to do this once! For all future webinars, you can simply click the link, add the reminder to your calendar and you’re good to go!

Video Tips – Two-way connection between Solidworks and ANSYS HFSS

This video will show you how you can set up a two-way connection between Solidworks and ANSYS HFSS so you can modify dimensions as you are iterating through designs from within HFSS itself. This prevents the need for creating several different CAD model iterations within Solidworks and allows a more seamless workflow.  Note that this process also works for the other ANSYS Electromagnetic tools such as ANSYS Maxwell.