Signal & Power Integrity Updates in Ansys 2021 R1 – Webinar

The use of Ansys Electronics solutions minimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products.

With signal and power integrity (SI & PI) analysis products, users can mitigate many electrical and thermal issues affecting printed circuit boards such as electromagnetic interference, crosstalk, overheating, etc. Ansys integrated electromagnetics and circuit simulation tools are essential for designing high-speed serial channels, parallel buses, and complete power delivery systems found in modern high-speed electronic devices.

Leverage the simulation capability from Ansys to solve the most critical aspects of your designs. Join PADT’s Electronics expert and application engineer Aleksandr Gafarov for a detailed look at what is new for SI & PI in Ansys 2021 R1, including updates available within the following tools:

• SIwave – Granta support & differential time domain crosstalk

• Q3D – Uniform current terminals

• Circuits – Network data explorer & SPISim

• HFSS 3D – Parallel meshing, encrypted 3D components & IC workflow improvements

• Electronics Desktop – Ansys cloud, Minerva & optiSLang integration

• And much more

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Electronics Reliability Updates in Ansys 2021 R1 – Webinar

Best practices for ensuring and predicting electronics reliability require comprehensive multi-physics simulations. Ansys ensures reliability success by developing solutions and workflows that overcome today’s biggest simulation and design challenges. 

With Ansys 2021 R1, electronics reliability became much easier to manager with advanced capabilities for design democratization, workflow automation, and robust reliability predictions. Along with these updated components, users can better access integrated workflows between Ansys Sherlock, Icepak, Mechanical, LS-Dyna, and more to provide the results necessary to optimize product designs and ensure unparalleled reliability in the field. 

Join PADT’s Systems Application & Support Engineer Josh Stout for a presentation covering updates to existing features and the introduction of new tools available in this latest release. Learn how users can:

• Extract detailed geometries from any ECAD file

     • Predict time to failure before prototyping

     • Perform complex multiphysics analyses

     • Implement automation and optimization 

     • And much more

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Thermal Integrity Updates in Ansys 2021 R1 – Webinar

With CAD-centric (mechanical and electrical CAD) and multiphysics user interfaces, Icepak facilitates the solving of today’s most challenging thermal management problems in electronics products and assemblies. Icepak uses sophisticated CAD healing, simplification and metal fraction algorithms that reduce simulation times, while providing highly accurate solutions that have been validated against real-world products.

This tool provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics solver for thermal and fluid flow analyses of integrated circuits, packages, printed circuit boards, and electronic assemblies.

With the release Ansys 2021 thermal integrity capabilities saw improvements in a variety of areas. Join PADT’s Application & Support Engineer and Thermal Integrity expert Josh Stout to learn more about recent advancements surrounding: 

• Solar Radiation Modeling

     • Robust Meshing Distribution

     • Dynamic Thermal Management

     • The Release of AEDT Mechanical Solutions

     • And Much More

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High Frequency Updates in Ansys 2021 R1 – Webinar

Whether leveraging improved workflows or leading-edge capabilities with Ansys 2021 R1, teams are tackling design challenges head on, eliminating the need to make costly workflow tradeoffs, developing next-generation innovations with increased speed and significantly enhancing productivity, all in order to deliver high-quality products to market faster than ever.

When it comes to high frequency electromagnetics, Ansys 2021 R1 delivers a plethora of groundbreaking enhancements. Ansys HFSS Mesh Fusion enables simulation of large, never before possible electromagnetic systems with efficiency and scalability. This release also allows for encrypted 3D components supported in HFSS 3D Layout for PCBs, IC packages and IC designs to enable suppliers to share detailed 3D component designs for creating highly accurate simulations.

Join PADT’s Lead Electromagnetics Engineer and high frequency expert Michael Griesi for a presentation on updates made to the Ansys HF suite in the 2021 R1 release, including advancements for:

  • Electronics Desktop
  • HFSS
  • Circuits
  • EMIT
  • And Much More

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All Things Ansys 070: Optimizing Electronics Reliability with Ansys Sherlock


Published on: August 24th, 2020
With: Eric Miller & Josh Stout

In this episode your host and Co-Founder of PADT, Eric Miller is joined by PADT’s Application & Support Systems Engineer, Josh Stout for a discussion on the unique capabilities of Ansys Sherlock, and what’s new for the tool in 2020 R2.

If you would like to learn more about this update, you can view Josh’s webinar on the topic here:

If you have any questions, comments, or would like to suggest a topic for the next episode, shoot us an email at we would love to hear from you!



SPISim – New addition to the Ansys Electronics family

In this article, I would like to introduce some new features added to the Ansys Electronics Solution 2020R2 release called SPISim. Since this is a new tool, I’ll focus on describing its capabilities as well as some possible applications.

What is SPISim?

Signal, Power Integrity and Simulation (SPISim) focuses on system-level and on-chip SI/PI modeling, simulation, and analysis. The tool presents a variety of different features, which are split on separate modules shown below.

Let us look at each module individually and highlight the key functionality.

There are 2 main Modules VPro and MPro. All the other features (sub-modules) are split between these main two.

VPro Core

This is a versatile GUI for viewing waveforms. It supports a wide variety of formats including .tr0, .ac0, .ibis, .csv, .mat, .raw, .snp, .citi, and more. Besides simple viewing capabilities, VPro can also be used for waveform analysis:

  • Overshoot and Undershoot (for Peaks and Valleys)
  • Threshold Crossings
  • Min/Max Peak-2-Peak
  • Root-Mean-Square Value 
  • FFT, iFFT
  • Correlation
  • Pulse to PDA

Using the information about waveforms, this tool can also plot an eye diagram, perform simple correlations, and run measurements. The viewer also supports framework scripting on JavaScript, Ruby, TCL, etc.

DPro Unit (VPro Module)

DPro (short for DDR Pro) provides comprehensive DDR related post-processing analysis. Key functionalities of this tool:

  • Batch mode of processing one or more waveform files
  • Support of multiple receiver processing
  • Built-in and customizable derating table and derating processing
  • Built-in 100+ measurement functions for typical DDR signal analysis
  • Results cross-probing and show problematic location automatically

The feature is organized in a wizard-like style. The user simply needs to fill out information in 6 tabs and click the ‘Run’ button. Overall, it is very intuitive to use, but like any new features, there is a learning curve for a new user.

TPro Unit (VPro Module)

It provides comprehensive transmission line related modeling, analysis, post-processing, and viewing capabilities. Here are several main functionalities offered by this add-on:

  • Comprehensive stackup planner to model t-lines’ performance in different stackup configurations
  • Advanced t-line modeling viewer for rapid analysis such as impedance, crosstalk, or propagation delay analysis
  • A table viewer for RLCG frequency content
  • What-if analysis for quick impedance/crosstalk calculation, and data processing, such as trimming and merging of frequency points
  • Batch mode processing and measurements for one or more t-line model files, result is a plain .csv file ready for further modeling or analysis

This feature helps the user to run pre-layout ‘what-if’ analysis. Both ‘transmission line analyzer’ and ‘layer stackup planner’ give the user a flexible way of understanding potential design constrains and guidelines.

SPro Unit (VPro Module)

This module is similar to TPro in a sense of the capabilities. However, it is directed to view and analyze S-parameters instead of tabular transmission line data. Also, in contrast to TPro, this feature has a separate tab ‘S-Param’ with all the features listed there.

Here are major capabilities of SPro:

  • Advanced s-parameter viewer for speedy analysis such TDR/TDR or PDA analysis
  • Table viewer for frequency content; export s-parameter data to matlab .mat format and more
  • 20+ advanced analysis functions such as mixed-mode conversion, cascading and renormalization
  • Batch mode processing and measurements for one or more s-parameter files
  • Support customizable s-parameter reporting generation for lab automation and beyond

Besides the conceptual similarities with the TPro, S-parameter’s waveform viewer based on VPro waveform viewer. Therefore, all operations available in VPro can also be found in S-parameter viewer.

Signal Generator Unit

This tool allows the user to generate a signal and use it in a future analysis. The generator offers wide variety of signal patterns (such as PRBS, Pulse, Sine, Square, Sawtooth etc) in combination with the PAM4 and NRZ modulation schemes. The user needs only to specify parameters for the signal and then create it.

This simple, but very powerful feature helps to save time for the engineer. 

MPro Core

By definition, MPro is a modeling unit, which helps the user to work with the data. However, modeling can mean different things. The main advantage of MPro is providing the user with the simple environment for data manipulation. Here are all main functionalities of this core module:

  • Table data processing: combine, extract, summarize statistically, etc
  • Plan sampling with design of experiments, full factorial, Monte Carlo, etc
  • Simulate or collect data using customizable scripts, supporting multi-CPU/multi-thread
  • Visualize data in statistical, 2D or 3D plots
  • Model data using response surface modeling, neural network (feed forward and radial basis), etc
  • Optimization using linear, nonlinear, or genetic algorithm methods

BPro IBIS and AMI Unit (MPro Module)

BPro is one unit, however in this description I have purposefully separated it into two – BPro IBIS and BPro AMI, because the functionality of BPro is very broad. It is easier to focus on a one thing at a time.

Generally, BPro brings comprehensive IBIS related modeling, analysis, post-processing, and viewing capabilities to user. In more detail:

  • Has an inspector to view IBIS model’s textual content and visualize various waveform/current table easily. Tool also allows manual editing of model data with a simple mouse click and drag
  • Built-in advanced IBIS model generation flow from either scratch or existing simulation data. Tool will guide user from modeling setup, spice decks generations, simulation, modeling, syntax checking with golden parser, validation to final figure of merits (FOM) reporting
  • Support batch mode generations of performance reports for one or more model files. Results are in .csv file format and can be used for further analysis
  • IBIS model generation from Spec. or data sheet without performing any simulation. Generated model will also have two sets of waveforms under different loading conditions

Under ‘IBIS’ menu tab, the user will find separate sets of commands for both IBIS and AMI, as well as commands for IBIS-AMI in general.


This new addition to Ansys Electronics Solution brings a very wide variety of features to engineers. All Waveform Viewer, Signal Generator, IBIS-AMI modeling, DDR analysis, Data optimization, and Transmission line planner are united under one tool – SPISim. We can launch this tool either from within Ansys 3D Layout or SIwave, and, in 2020R2, is accessible through the Electronics Enterprise license.

Here is an overview of the SPISIm functionality:

Besides developing the help documentation and video demos, SPISim engineer team provides users with the detailed information about the tool in their blog –  and helps to fill out the technical ‘gaps’ by sharing the reference material –

If you would like more information related to this topic or have any questions, please reach out to us at

Optimizing Electronics Reliability with Ansys Sherlock – Webinar

Ansys Sherlock automated design analysis software is the only Reliability Physics/Physics of Failure (PoF)-based electronics design analysis software that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages. A unique, powerful capability of Sherlock is its revolutionary ability to rapidly convert electronic CAD (ECAD) files into CFD and FEA models with accurate geometries and material properties.

Through its powerful parsing engine and embedded libraries containing over 500,000 parts, Sherlock reduces pre-processing time from days to minutes and automates workflows through its integration with Ansys Icepak, Ansys Mechanical and Ansys Workbench.

With its extensive parts/materials libraries, Sherlock automatically identifies your files and imports your parts list, then builds an FEA model of your circuit board in minutes. It also produces a holistic analysis that is critical to developing reliable electronics products. It enables designers to simulate each environment, failure mechanism and assembly that a product might encounter over its lifespan.

Join PADT’s Systems Application & Support Engineer Josh Stout for an introduction to this powerful tool along with a look at what new features and updates have been added in the Ansys 2020 R2 version.

Register Here

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You will only have to do this once! For all future webinars, you can simply click the link, add the reminder to your calendar and you’re good to go!

“Equation Based Surface” for Conformal and Non-Planar Antenna Design

ANYSY HFSS provides many options for creating non-planar and conformal shapes. In MCAD you may use shapes such as cylinders or spheres, and with some steps, you can design you antennas on various surfaces. In some applications, it is necessary to study the effect of curvatures and shapes on the antenna performance. For example for wearable antennas it is important to study the effect of bending, crumpling and air-gap between antenna and human body.

Equation Based Surface

One of the tools that HFSS offers and can be used to do parametric sweep or optimization, is “Draw equation based surface”. This can be accessed under “Draw” “Equation Based Surface” or by using “Draw” tab and choosing it from the banner (Fig. 1)

Fig. 1. (a) Select Draw -> Equation Based Surface
Fig. 1. (b) click on the icon that is highlighted

Once this is selected the Equation Based Surface window that opens gives you options to enter the equation with the two variables (_u, _v_) to define a surface. Each point of the surface can be a function of (_u,_v). The range of (_u, _v) will also be determined in this window. The types of functions that are available can be seen in “Edit Equation” window, by clicking on “…” next to X, Y or Z (Fig. 2). Alternatively, the equation can be typed inside this window. Project or Design Variables can also be used or introduced here.

Fig. 2. (a) Equation Based Surface window
Fig. 2. (b) Clikc on the “…” next to X and see the “Edit Equation: window to build the equation for X

For example an elliptical cylinder along y axis can be represented by:

This equation can be entered as shown in Fig. 3.

Fig. 3. Elliptical surface equation

Variation of this equation can be obtained by changing variables R1, R2, L and beta. Two examples are shown in Fig. 4.

Fig. 4. Elliptical surface equation

Application of Equation Based Surface in Conformal and Non-Planar Antennas

To make use of this function to transfer a planar design to a non-planar design of interest, the following steps can be taken:

  • Start with a planar design. Keep in mind that changing the surface shape can change the characteristics of the antenna. It is a good idea to use a parameterized model, to be able to change and optimize the dimensions after transferring the design on a non-planar surface. As an example we started with a planar meandered line antenna that works around 700MHz, as shown in Fig. 5. The model is excited by a wave port. Since the cylindrical surface will be built around y-axis, the model is transferred to a height to allow the substrate surface to be made (Fig 5. b)
Fig. 5. Planar meandered antenna (a) on xy plane, (b) moved to a height of 5cm
  • Next, using equation based surface, create the desired shape and with the same length as the planar substrate. Make sure that the original deisgn is at a higher location. Select the non-planar surface. Use Modeler->Surface->Thicken Sheet … and thicken the surface with the substrate thickenss. Alternatively, by choosing “Draw” tab, one can expand the Sheet dropdown menu and choose Thicken Sheet. Now select the sheet, change the material to the substrate material.
Fig. 6. Thicken the equation based surface to generate the substrate
  • At this point you are ready to transfer the antenna design to the curved surface. Select both traces of the antenna and the curved substrate (as shown in Fig. 7). Then use Modeler->Surface->Project Sheet…, this will transfer the traces to the curved surface. Please note that the original substrate is still remaining. You need not delete it.
Fig. 7. Steps for transferring the design to the curved surface (a)

Fig. 7. Steps for transferring the design to the curved surface (b)

Fig. 7. Steps for transferring the design to the curved surface (c)
  • Next step is to generate the ground plane and move the wave port. In our example design we have a partial ground plane. For ground plane surface we use the same method to generate an equation based surface. Please keep in mind that the Z coordinate of this surface should be the same as substrate minus the thickness of the substrate. (If you thickened the substrate surface to both sides, this should be the height of substrate minus half of the substrate thickness). Once this sheet is generate assign a Perfect E or Finite Conductivity Boundary (by selecting the surface, right click and Assign Boundary). Delete the old planar ground plane.
Fig. 8. Non-planar meandered antenna with non-planar ground

Wave Port Placement using Equation Based Curve

A new wave port can be defined by the following steps:

  • Delete the old port.
  • Use Draw->Equation Based Curve. Mimicking the equation used for ground plane (Fig. 9).
Fig. 9. Use Equation Based Curve to start a new wave port (a) Equation Based Curve definition window (b) wave pot terminal created using equation based curve and sweep along vector
  • Select the line from the Model tree, select Draw->Sweep->Along Vector. Draw a vector in the direction of port height. Then by selecting the SweepAlongVector from Model tree and double clicking, the window allows you to set the correct size of port height and vector start point (Fig. 10).
  • Assign wave port to this new surface.
Fig. 10. Sweep along vector to create the new wave port location

Similar method can be used to generate (sin)^n or (cos)^n surfaces. Some examples are shown in Fig. 11. Fig. 11 (a) shows how the surface was defined.

Fig. 11. (a) Equation based surface definition using “cos” function, (b), (c), & (d) three different surfaces generated by this equation based surface.

Effect of Curvature on Antenna Matching

Bending a substrate can change the transmission line and antenna impedance. By using equation based port the change in transmission line impedance effect is removed. However, the overall radiation surface is also changed that will have effects on S11. The results of S11 for the planar design, cylindrical design (Fig. 8), cos (Fig. 11 b), and cos^3 (Fig. 11 c) designs are shown in Fig. 12. If it is of interest to include the change in the transmission line impedance, the port should be kept in a rectangular shape.

Fig. 12. Effect of curvature on the resonance frequency.

Equation based curves and surfaces can take a bit of time to get used to but with a little practice these methods can really open the door to some sophisticated geometry. It is also interesting to see how much the geometry can impact a simple antenna design, especially with today’s growing popularity in flex circuitry. Be sure to check out this related webinar  that touches on the impact of packaging antennas as well. If you would like more information on how these tools may be able to help you and your design, please let us know at

You can also click here to download a copy of this example.

DesignCon 2017 Trends in Chip, Board, and System Design

Considered the “largest gathering of chip, board, and systems designers in the country,” with over 5,000 attendees this year and over 150 technical presentations and workshops, DesignCon exhibits state of the art trends in high-speed communications and semiconductor communities.

Here are the top 5 trends I noticed while attending DesignCon 2017:

1. Higher data rates and power efficiency.

This is of course a continuing trend and the most obvious. Still, I like to see this trend alive and well because I think this gets a bit trickier every year. Aiming towards 400 Gbps solutions, many vendors and papers were demonstrating 56 Gbps and 112 Gbps channels, with no less than 19 sessions with 56 Gbps or more in the title. While IC manufacturers continue to develop low-power chips, connector manufacturers are offering more vented housings as well as integrated sinks to address thermal challenges.

2. More conductor-based signaling.

PAM4 was everywhere on the exhibition floor and there were 11 sessions with PAM4 in the title. Shielded twinaxial cables was the predominant conductor-based technology such as Samtec’s Twinax Flyover and Molex’s BiPass.

A touted feature of twinax is the ability to route over components and free up PCB real estate (but there is still concern for enclosing the cabling). My DesignCon 2017 session, titled Replacing High-Speed Bottlenecks with PCB Superhighways, would also fall into this category. Instead of using twinax, I explored the idea of using rectangular waveguides (along with coax feeds), which you can read more about here. I also offered a modular concept that reflects similar routing and real estate advantages.

3. Less optical-based signaling.

Don’t get me wrong, optical-based signaling is still a strong solution for high-speed channels. Many of the twinax solutions are being designed to be compatible with fiber connections and, as Teledyne put it in their QPHY-56G-PAM4 option release at DesignCon, Optical Internetworking Forum (OIF) and IEEE are both rapidly standardizing PAM4-based interfaces. Still, the focus from the vendors was on lower cost conductor-based solutions. So, I think the question of when a full optical transition will be necessary still stands.
With that in mind, this trend is relative to what I saw only a couple years back. At DesignCon 2015, it looked as if the path forward was going to be fully embracing optical-based signaling. This year, I saw only one session on fiber and, as far as I could tell, none on photonic devices. That’s compared to DesignCon 2015 with at least 5 sessions on fiber and photonics, as well as a keynote session on silicon photonics from Intel Fellow Dr. Mario Paniccia.

4. More Physics-based Simulations.

As margins continue to shrink, the demand for accurate simulation grows. Dr. Zoltan Cendes, founder of Ansoft, shared the difficulties of electromagnetic simulation over the past 40+ years and how Ansoft (now ANSYS) has improved accuracy, simplified the simulation process, and significantly reduced simulation time. To my personal delight, he also had a rectangular waveguide in his presentation (and I think we were the only two). Dr. Cendes sees high-speed electrical design at a transition point, where engineers have been or will ultimately need to place physics-based simulations at the forefront of the design process, or as he put it, “turning signal integrity simulation inside out.” A closer look at Dr. Cendes’ keynote presentation can be found in DesignNews.

5. More Detailed IC Models.

This may or may not be a trend yet, but improving IC models (including improved data sheet details) was a popular topic among presenters and attendees alike; so if nothing else it was a trend of comradery. There were 12 sessions with IBIS-AMI in the title. In truth, I don’t typically attend these sessions, but since behavioral models (such as IBIS-AMI) impact everyone at DesignCon, this topic came up in several sessions that I did attend even though they weren’t focused on this topic. Perhaps with continued development of simulation solutions like ANSYS’ Chip-Package-System, Dr. Cende’s prediction will one day make a comprehensive physics-based design (to include IC models) a practical reality. Until then, I would like to share an interesting quote from George E. P. Box that was restated in one of the sessions: “Essentially all models are wrong, but some are useful.” I think this is good advice that I use for clarity in the moment and excitement for the future.

By the way, the visual notes shown above were created by Kelly Kingman from on the spot during presentations. As an engineer, I was blown away by this. I have a tendency to obsess over details but she somehow captured all of the critical points on the fly with great graphics that clearly relay the message. Amazing!